Guidance Electronics Unit

Precision Guided Munitions have become an essential dimension in warfare. Our Guidance Electronics Unit (GEU) provides an integrated hardware and software solution designed to deliver a reliable ‘Compute and Control’ platform for data fusion and algorithm implementation. Developed by General Dynamics Missions Systems, the GEU is designed to be resilient even in the most austere environments. Regardless of the munitions used today, the GEU is a customizable solution designed for the technology of tomorrow’s warfighter.

  • Designed for harsh environments & 20-year shelf life
  • Prevents accidental firing when severe shock is encountered
  • Operational after extreme flight vibration levels up to 300Hz
  • Protects against centrifugal force damage
  • Ruggedized platform that mitigates risk of electrical shorts

Features

  • Single board solution without DDR
  • Two board solution supports DDR and Magnetometer options
  • Information Assurance (IA) & Security Features
    • Trusted boot sequence upon loading the Boot Image
    • HMAC/AES design for local authentication and encryption
    • Hardware partitioning for mission critical data
  • Testability
    • Accessible test interfaces and user serial ports via the Microcontroller and the SoC
    • Extensive test-point coverage on back of board to enable high level of factory test automation; 177 accessible test-points
    • On-board recording used to collect performance data

Technical Specifications

View Datasheet

Mission Ready Passive Clearing: Mission Data stored in volatile memory and removed when transitioned to an OFF State
Zeroization for Temporary Key Storage: GPS crypto variables cleared using an overwrite algorithm in accordance with GPU-PRD-105-A1
Dimensions & Weight
Board Thickness .082”
Board Thickness with components .512”
Board Width 2.375”
Weight: .87 oz
Environmental Specifications
Operating Temperature: -25°F to +145º F
Operating Altitude: -2,000’ up to 70,000’
Transportation Shock and Vibration
MIL-STD-810G with Change 1, Method 514.7, Procedure I – General Vibration, Transportation, Category 4 Common Carrier Compliance
Performance
Power-up to operational time in less than 1000 ms
Data Hold Solution provides 3.3V to the GEU and subsystems beyond
7:45 minutes
Customizable Subsystem Interfaces
CAS 40-pin Interface
External/Setter Interface via the CAS Interface
 - Single interface for all maintenance activities and loading setting data
 - RS422 to RS232 conversion
 - Autopolarity correction
10PPS Timing Pulse used to create a timing reference for the system
HOB/TM via the CAS Interface
IMU 10-pin Interface
GPS 40-pin Interface
Fuze 12-pin Interface
Thermal Battery 6-pin Interface
Super Capacitor 2-pin Interface
Processor
Single Core Processor
Up to 768KM of Memory (L2 Cache 512KB & On-Chip Memory 256KB)
JTAG Debugging Mode
Microcontroller/Power Manager
Up to 40 I/Os
Operating Supply Voltage 1.8 V to 3.6 V
Power sequencing to distribute inrush power demand
JTAG Debugging Mode
Power
GEU draws 18-24VDC up to 40W from the External/Setter interface when connected
Electromagnetic Interference (EMI)
Provides EMI/ESD protections External/Setter interface
External/Setter interface is de-energized in less than 10 seconds after being disconnected from the socket
Lightning and Grounding
Complies MIL-STD-464 Near Strike Lightning
Board design is electrically isolated from chassis
Single point ground architecture back to the External/Setter interface
Structural Criteria
Designed to perform following exposure up to 20,000 RPMs peak spin
acceleration during firing
Setback and Spin:
 - Board Max Stress 15306 psi
 - Support Max Stress 29792 psi
Reliability MTBF (Hours), 25°C
Controlled Storage: 1,409,375
Stockpile Surveillance: 1,497,160
Uncontrolled Storage: 421,039
Transportation & Prepare, mobile: 1,585,332
Fuze Setting/Initialization, outdoors: 881,921
Data Hold, outdoors: 881,921
Launch: 667,405
Flight: 862,550
  • Features

    Features

    • Single board solution without DDR
    • Two board solution supports DDR and Magnetometer options
    • Information Assurance (IA) & Security Features
      • Trusted boot sequence upon loading the Boot Image
      • HMAC/AES design for local authentication and encryption
      • Hardware partitioning for mission critical data
    • Testability
      • Accessible test interfaces and user serial ports via the Microcontroller and the SoC
      • Extensive test-point coverage on back of board to enable high level of factory test automation; 177 accessible test-points
      • On-board recording used to collect performance data
  • Specifications

    Technical Specifications

    View Datasheet

    Mission Ready Passive Clearing: Mission Data stored in volatile memory and removed when transitioned to an OFF State
    Zeroization for Temporary Key Storage: GPS crypto variables cleared using an overwrite algorithm in accordance with GPU-PRD-105-A1
    Dimensions & Weight
    Board Thickness .082”
    Board Thickness with components .512”
    Board Width 2.375”
    Weight: .87 oz
    Environmental Specifications
    Operating Temperature: -25°F to +145º F
    Operating Altitude: -2,000’ up to 70,000’
    Transportation Shock and Vibration
    MIL-STD-810G with Change 1, Method 514.7, Procedure I – General Vibration, Transportation, Category 4 Common Carrier Compliance
    Performance
    Power-up to operational time in less than 1000 ms
    Data Hold Solution provides 3.3V to the GEU and subsystems beyond
    7:45 minutes
    Customizable Subsystem Interfaces
    CAS 40-pin Interface
    External/Setter Interface via the CAS Interface
     - Single interface for all maintenance activities and loading setting data
     - RS422 to RS232 conversion
     - Autopolarity correction
    10PPS Timing Pulse used to create a timing reference for the system
    HOB/TM via the CAS Interface
    IMU 10-pin Interface
    GPS 40-pin Interface
    Fuze 12-pin Interface
    Thermal Battery 6-pin Interface
    Super Capacitor 2-pin Interface
    Processor
    Single Core Processor
    Up to 768KM of Memory (L2 Cache 512KB & On-Chip Memory 256KB)
    JTAG Debugging Mode
    Microcontroller/Power Manager
    Up to 40 I/Os
    Operating Supply Voltage 1.8 V to 3.6 V
    Power sequencing to distribute inrush power demand
    JTAG Debugging Mode
    Power
    GEU draws 18-24VDC up to 40W from the External/Setter interface when connected
    Electromagnetic Interference (EMI)
    Provides EMI/ESD protections External/Setter interface
    External/Setter interface is de-energized in less than 10 seconds after being disconnected from the socket
    Lightning and Grounding
    Complies MIL-STD-464 Near Strike Lightning
    Board design is electrically isolated from chassis
    Single point ground architecture back to the External/Setter interface
    Structural Criteria
    Designed to perform following exposure up to 20,000 RPMs peak spin
    acceleration during firing
    Setback and Spin:
     - Board Max Stress 15306 psi
     - Support Max Stress 29792 psi
    Reliability MTBF (Hours), 25°C
    Controlled Storage: 1,409,375
    Stockpile Surveillance: 1,497,160
    Uncontrolled Storage: 421,039
    Transportation & Prepare, mobile: 1,585,332
    Fuze Setting/Initialization, outdoors: 881,921
    Data Hold, outdoors: 881,921
    Launch: 667,405
    Flight: 862,550
  • Literature